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Technology
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Min trace/space (inner/external) : |
3/3 mil 0.075/0.075 mm |
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Min drill size for through hole : |
drill 8.0 mil 0.20mm |
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Laser drill : |
4 mil 0.1mm |
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Copper Foil Thickness : |
17-210um |
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Inner Core Thickness : |
± 0.08mm |
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Tolerance of total board thickness : |
±0.015mm |
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Max. Unit Area: |
700-800mm |
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Min.Unit Area: |
2-5mm |
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Max Layer |
18 Layers |
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Surface Treatment
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Solder Coating Thickness Sn: |
4-20um |
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Cobalt/Gold plating ,Hard Gold Thickness : |
Ni: 5 -10um Au: 0.05-0.20um |
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Gold/Nickel Plating Thickness: |
Ni: 5-10um Au: 0.05-0.15um |
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OSP Coating Thickness: |
0.2-0.5um |
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Electroness Au Thickness: |
Ni 3-15um Au 0.025-0.10um |
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Chem. Tin Thickness: |
Sn 0.8-5um |
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Producting Capacity
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Each day: 800-1000㎡ |
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Delivery time:
The company is committed to the supply of samples with in 2-4 days
And mass production products with in 5-10days.
Quickly supply of sample with in 24-36 hours
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